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First commercial agreement in PE to create integrated printed systems for high volume production and multiple markets.
July 11, 2012
By: DAVID SAVASTANO
Editor, Ink World Magazine
Thin Film Electronics ASA (Thinfilm) and Bemis Company, Inc., a Fortune 500 supplier of flexible packaging and pressure sensitive materials, announced an agreement to develop a flexible sensing platform for the packaging market. The result will be a new category of packaging that can collect and wirelessly communicate sensor information, for use by leading food, consumer products and healthcare companies worldwide. Thinfilm has previously announced technology partnerships to develop an inexpe...
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